Title
Semiconductor 3D Equipment and Materials Consortium (EMC-3D)
Date
10/28/2015
(Last Updated: 10/28/2015)
(Last Updated: 10/28/2015)
Status
Inactive
Abstract
EMC3D (Semiconductor 3D Equipment and Materials Consortium) developed the market for 3D technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process. TSV processes were developed for chip integration and MEMS/sensor packaging based on plated metal electrodes and thinned wafers. *Inactive