10/28/2015
Developed a cost-effective TSV (thru-silicon-via) for 3D chip stacking and MEMS integration *Inactive
Developed a cost-effective TSV (thru-silicon-via) for 3D chip stacking and MEMS integration *Inactive
Promotes the global semiconductor equipment, materials, and flat panel display industries.
Promoted interoperability test methods for complex logic devices *Inactive
Developed and maintained the SPMT specification and promotes designing and manufacturing mobile devices, integrated circuits, and semiconductor IP
Develops and promotes the adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to-market and meet the challenges of sub-micron design
Promotes silicon-on insulator (SOI) technology innovation into broad markets.
Supports numerous open-source software projects
Develops and promotes the advancement of UCIe (Universal Chiplet Interconnect Express) technology, a standard defining the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level
Develops and provides open standards and certification for “Ultra Short Reach” (USR) links within Multi-Chip Modules (MCMs)
Developed the UXPi Technical Specification and promoted interoperable specifications for the semiconductor industry